Advanced ceramic material for high power hybrid semiconductor packaging where high thermal conductivity is required. AlN substrates have a thermal conductivity of 170 W/Mk and available in standard thicknesses in sizes up to 100 mm (4") square.

Silicon Carbide

SiC substrates are formed using a proprietary CVD process, are extremely uniform, 5Ns pure, and 100% dense.

Please click on the "Contact Us" button below for details of our ceramic substrate materials and capabilities.